Pioneering SOP technology for convergent and ultraminiaturized electronic and bioelectronic systems based on the new fundamental microelectronic paradigm, pioneered by Prof. Tummala, called System-on-Package with advances in high density interconnections, mixed signal design and testing, opto, RF, and analog and sensor integration and nano wafer level packaging,
Design-Build-Operate (DBO) hands-on education at undergraduate level